Research
Technical papers and research advancing deterministic, solver-accurate physics simulation for real-world engineering systems.
Full-Fidelity Thermal Simulation at Floorplanning Speed for 2.5D AI Accelerator Packages
Power densities in modern AI accelerators and HPC devices now routinely exceed 1 W/mm². At the same time, 2.5D packages co-integrate high-power accelerator ASICs (e.g., NVIDIA, AMD) with 8–16 High Bandwidth Memory (HBM) stacks (e.g., Micron, Samsung, SK Hynix), pushing system-level thermal behavior to fundamental limits.
Deterministic, Solver-Accurate Thermal and Warpage Analysis at Manufacturing Resolution for Advanced 2.5D HBM Packages
This research introduces a dynamic reinforcement learning approach that leverages continuous feedback to adapt agent behavior in real time. Results indicate substantial improvements in decision accuracy and environmental responsiveness, particularly in unpredictable or rapidly changing scenarios.
Thermal Sensitivity Analysis of 3D IC Face-to-Back Stacking Using Foundation Models for Physics
As semiconductor devices push toward higher integration densities and 3D stacking, thermal management has emerged as a critical design bottleneck.
Copresheaf Topological Neural Networks: A Generalized Deep Learning Framework
We introduce copresheaf topological neural networks (CTNNs), a powerful unifying framework that encapsulates a wide spectrum of deep learning architectures, designed to operate on structured data, including images, point clouds, graphs, meshes, and topological manifolds.
Towards AI-Assisted Design of Thermal Management Strategies
This research introduces a dynamic reinforcement learning approach that leverages continuous feedback to adapt agent behavior in real time. Results indicate substantial improvements in decision accuracy and environmental responsiveness, particularly in unpredictable or rapidly changing scenarios.
