Where Vinci joins engineers, researchers, and industry leaders to discuss the future of physics-driven engineering.
ISIG Executive Summit Taiwan brings together senior semiconductor leaders focused on AI infrastructure, silicon photonics, advanced packaging, interconnect, and next-generation system design. Vinci will be attending to meet with industry leaders and technical decision-makers working on the physical constraints shaping advanced semiconductor systems.
ITF World is imec’s flagship global technology forum, bringing together leaders across semiconductors, AI, deep tech, research, and advanced manufacturing. Vinci will be attending to connect with teams working on the physical infrastructure behind next-generation AI systems, where deterministic, solver-accurate physics is increasingly important for understanding complex hardware behavior before it is built.
DAC is a leading global conference for chips-to-systems design, bringing together designers, researchers, EDA leaders, tool developers, and semiconductor practitioners to discuss the latest advances in electronic design and automation.
Vinci will join the DAC Engineering Track for a special session titled “Deterministic, Solver-Accurate Physics Intelligence for Chips-to-Systems Design: What Breaks, What Validates, What Automates.” The discussion will focus on how deterministic, solver-accurate physics intelligence can help make simulation more repeatable, automated, and usable across complex chips-to-systems engineering workflows.