Newsroom

Electronics Weekly covers Vinci's thermo-mechanical simulation tool, which predicts stress and warpage across full-resolution hardware designs under real-world thermal conditions.

In this Pulse 2.0 interview, Hardik Kabaria discusses the company’s origins, the technical motivation behind building a foundation model for physics, and how Vinci is working to make physics continuously computable inside engineering workflows.

In this Electronic Design article, Hardik Kabaria argues that modern hardware design is no longer limited by compute alone, but by how and when physics can be evaluated in the workflow.

In this Semiconductor Engineering article, Satish Radhakrishnan explains why episodic simulation workflows are increasingly misaligned with the pace and complexity of modern semiconductor design.

In this SemiWiki interview, Vinci CEO Hardik Kabaria discusses why engineering requires AI systems that are repeatable, physically grounded, and usable in production workflows.

This Electronics For You article covers Vinci’s thermo-mechanical simulation capability for automated warpage analysis in hardware designs.

In this Pulse 2.0 article, Vinci discusses its $46 million in total funding, its emergence from stealth, and its platform for semiconductor design and simulation.

In this SiliconANGLE article, Vinci discusses its $46 million in funding and its platform for AI-powered chip simulation.

In this Reuters article, Vinci discusses its $36 million Series A and its work building software for hardware simulation in chip and other design workflows.