Vinci brings physical reasoning in full-fidelity to hardware designs—so engineers can explore, validate, and realize performance that was previously impractical, infeasible, or inconceivable.
Solver-accurate. Zero setup. Zero training. Real products. Real scale.
For decades, physics has been evaluated intermittently—through simulations run by specialists, at discrete points in the design cycle. That approach worked when systems were simpler and expert time could scale with complexity.
That world is gone.
Modern hardware concentrates more physics across more scales—dense geometry, heterogeneous materials, tightly coupled effects, and real manufacturing constraints. The limiting factor is no longer physics accuracy, but how often and how broadly it can be applied.
Instead of running isolated simulations to check designs, engineers can continuously reason about physical behavior—at manufacturing resolution—throughout exploration, optimization, and validation.
This is not faster simulation.
It’s a fundamentally different way to design hardware.
Results are validated against first-principles commercial FEA solvers — not proxies or surrogates
No meshing, defeaturing, parameter fitting, or per-case configuration — ever
Native, full-resolution design files ingested end-to-end with no translation
From ingestion through convergence with no human intervention — enabling continuous, validated simulation
Runs behind the firewall with a single global model
This system natively integrates a physics foundation model with execution to ensure self-verifying, manufacturing-resolution accuracy without approximations. It delivers high-fidelity performance at scale.
Vinci directly ingests complete, native geometry representations for dies, packages, boards, and systems.
This enables accurate simulation of full designs at nanometer-scale resolution while supporting large parameter sweeps and design-of-experiments.
Vinci’s physics foundation model provides a physics-informed inference solution that accelerates convergence without introducing approximation or nondeterminism.
The model is not probabilistic and does not hallucinate. It operates within physical constraints and feeds directly into solver-based verification.
The Vinci GPU physics solver performs automated meshing and solver-accurate convergence at production scale:
Simulation outputs are converted into verified, physics-consistent visual insights:
Vinci enables steady-state and transient thermal analysis on real hardware designs—at the resolution they are actually built—so engineers can reason about heat where it truly matters.
Engineers use Vinci to evaluate thermal behavior across dense, multi-material assemblies that traditionally require simplification or late-stage validation. This includes advanced packages, stacked die, high-power boards, and tightly integrated systems where local geometry and interfaces dominate heat flow.
In practice, this means teams can run manufacturing-resolution thermal analysis early and repeatedly—without collapsing designs, abstracting critical features, or limiting scope to what’s manually tractable.
Printed Circuit Board
Powermap on 2.5D Package
2.5D Package Hot Spot
Metal & Via Layers Conduction Simulation
Simulated to Nanometer Sized Features
Thermal analysis stops being a one-off check at the end of the process.
It becomes a reliable, repeatable input into everyday design decisions—at the scale and fidelity modern hardware demands.
Evaluate manufacturing-resolution thermal conduction workflowsVinci provides production-grade thermo-mechanical simulation for complex hardware systems, enabling deterministic prediction of stress, deformation, and global warpage directly from full-fidelity designs.
Rather than approximating mechanical behavior through simplified blocks or rule-of-mixtures models, Vinci operates on real geometry and real material interfaces. Thermal loads, material mismatch, and structural constraints are resolved together—at manufacturing resolution—so mechanical behavior reflects how the product is actually built, assembled, and operated.
Thermo-mechanical physics is solved across scales, from fine-grained material and layout detail to full system assemblies. Results are deterministic and solver-accurate, making them stable enough for comparison, regression, and automated design exploration—without manual setup or tuning.
These capabilities allow engineers to reason about warpage and mechanical reliability earlier in development, when design choices are still flexible and risk can be retired before late-stage validation.
Modular Chiplet Package
Modular Chiplet Package Exploded View
Modular Chiplet Package Displacement at High Temperature Condition
Modular Chiplet Package Displacement at Low Temperature Condition
Thermo-mechanical analysis stops being a late-stage risk check. It becomes a deterministic, repeatable input into everyday design decisions—so stress, deformation, and warpage can be understood early, compared meaningfully, and signed off with confidence.
Evaluate manufacturing-resolution warpage and stress workflows
