Complex warpage, resolved while the design is still moving.
In stacked-die, interposer and fan-out flows, warpage is set by TSVs, thin-die stacks, RDL and material interfaces — the features a solvable model usually has to throw away. Vinci solves the full stackup at manufacturing resolution, from native design data, in seconds. Enough to evaluate every stackup and material option — before assembly rules are frozen.
1.69 BILION DOF
Solved in 3 minutes
MEASURED. MATCHED.
With experimental data
AUTOMATED MESHING
From native GDS / OAS Stackup data
See the demo
Model the Entire Package
See warpage across HBM stacks, interposers and heterogeneous packages at full fidelity — and explore alternatives while die, stackup and materials are still changing. Same platform, same foundation model, every package.
Shift Left on Warpage: Thermo-Mechanical Analysis Before the Design Locks
The longer version of what’s running at the kiosk. Daniel Nenni hosts John Bruggeman and Satish Radhakrishnan.
