Physics-Accurate Design and Simulation at Manufacturing Resolution
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Physics has Vinci: The First Foundation Model for Physics.
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Simulation tools haven’t kept pace with modern design complexity
Setup takes hours, compute can take days
Approximations distort results
Physics gets simplified to meet compute limits
Every shortcut widens the gap between design intent and as-built reality
Introducing Vinci
Vinci combines a foundation model for physics with GPU-native solvers to deliver unprecedented simulation speed and accuracy. There’s no meshing, no approximations, and customer data is not required to train the model: it simply works out of the box. Vinci enables engineers to run thousands of simulations seamlessly, transforming how complex physical systems are designed and optimized.
Results
Over half of the top 20 semiconductor companies have already benchmarked Vinci against traditional FEA Solvers and experimental results. In every case, Vinci results were confirmed.
In the example below, Vinci performed material characterization for each tile in a chip package to compute the three directional effective conductivities, and then performed full-package thermal analysis using the computed effective conductivities to obtain the temperature field over the entire domain.
Vinci’s results were 360x faster and functionally identical, without accounting for the setup and meshing hours required by the commercial FEA solver.
Vinci Prediction
Commercial FEA Solver
Max
100.00 ºC
101.11 ºC
Avg
56.49 ºC
56.50 ºC
Min
26.18 ºC
25.93 ºC
DoF
117,440,512
117,440,512
Meshing
Automated
Manual
Compute time
20 Sec
2 Hours
Vinci Prediction
Max
100.00 ºC
Avg
56.49 ºC
Min
26.18 ºC
DoF
117,440,512
Meshing
Automated
Compute time
20 Sec
Commercial FEA Solver
Max
101.11 ºC
Avg
56.50 ºC
Min
25.93 ºC
DoF
117,440,512
Meshing
Manual
Compute time
2 Hours
Reserve your copy of our EPTC 2025 Paper: Learn how Vinci, in partnership with a major semiconductor company, performed full-scale stacked IC simulations, including hybrid bonding and BEOL layers, validated against physical measurements. In under a minute, we determined that the Thermal Interface Material (TIM) was the dominant thermal bottleneck, and improving its conductivity yielded the largest temperature reduction.
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Accuracy:
<2% Deviation
Complexity: