Vinci is built to handle the full spectrum of physical analysis, and its long-term vision is to power every stage of hardware development.
THE FIRST LAYER: HIGH-FIDELITY THERMAL ANALYSIS
Thermal performance is a critical factor in product reliability, efficiency, and safety. Vinci’s first commercially-available application enables any engineer to run nanometer-accurate thermal simulations in seconds, and is already in use at several major semiconductor companies.
THE NEXT STEPS: MULTI-PHYSICS AND STRUCTURAL ANALYSIS
The same AI-native architecture that powers thermal analysis will be extended to structural stress, vibration, fluid dynamics, and electromagnetic compatibility.
TOWARD AI-NATIVE DESIGN OPTIMIZATION
Once simulation speed is no longer a bottleneck, the next frontier is optimization. Vinci is already powering AI-driven design loops that are only possible with fast multivariate simulations. Engineers can easily explore changes in geometry or materials that would have been previously left unexplored. This allows teams to converge on optimal designs faster than ever before.
INTEGRATION ACROSS THE HARDWARE STACK
Vinci aims to integrate seamlessly with CAD systems, product software, and manufacturing toolchains, creating an unbroken digital thread from concept to production. By embedding AI-native simulation and optimization into these environments, engineering teams will have continuous access to high-fidelity insights at every decision point.
Thermal simulation may be the entry point, but the destination is far larger: a complete AI-native workflow for hardware design, validation, and optimization.
